Description Machine Name Model No Features
Low Level SMD Placement Machine /
Chip Shooter		 MK1C NM-2562C 0.28sec, 100cst, 10 head*2 nozzie,dispenser 1 head*3 nozzle, M size
NM-2565C 0.28sec, 100cst, 10 head*2 nozzie,dispenser 1 head*3 nozzle, LL size
MK2C NM-2563C 0.14sec,68x2cst, two Rotary head, 10 head
MK2F NM-2563F 0.120sec,136cst, two Rotary head
MV-150 NM-2555 0.25sec, 100cst, 10 head ( 5 nozzle ), M size
NM-2556 0.25sec, 100cst, 10 head ( 5 nozzle ), LL size
NM-2555D 0.22sec, 75+75cst, 10 head ( 5 nozzle ), Option (Dispenser ), M size
NM-2556D 0.22sec, 75+75cst, 10 head ( 5 nozzle ), Option (Dispenser ), LL size
NM-2555F 0.22sec, 75+75cst, Option ( dispenser ), M size
NM-2556F 0.22sec, 75+75cst, Option ( dispenser ), LL size
MVII / MV2 NM-2558A 0.18sec, 55+55cst, 12 head ( 5 nozzle ), M size
NM-2558B 0.18sec, 75+75cst, 12 head ( 5 nozzle ), M size
NM-2559BA 0.18sec, 75+75cst, 12 head ( 5 nozzle ), LL size
MVIIC / MV2C NM-2558C 0.14sec, 75+75cst, 12 head ( 5 nozzle ) M size
NM-2559CA 0.14sec, 75+75cst, 12 head ( 5 nozzle ) LL size
NM-2558D 0.14sec, 75+75cst, 12 head ( 5 nozzle ), M size
NM-2559DA 0.14sec, 75+75cst, 12 head ( 5 nozzle ), LL size
High Volume, Low Mix
SMD Placement Machine / Chip Shooter		 MSH NM-2576A 0.14sec, 75+75cst, 10 head ( 3 nozzle ), M size
NM-2578 0.14sec, 75+75cst, 10 head ( 3 nozzle ), LL size
MSHG1 NM-2576C 0.14sec, 2 nozzle
MSHG3 NM-HC00A 0.07 sec, 60cst, 10 head ( 2 nozzle )
NM-HC20A 0.14sec, 60cst, 10 head (2 nozzle )
MSHII / MSH2 NM-2577C 0.094sec, 75+75cst, 16 head ( 3 nozzle ), M size
NM-2577N 0.094sec, 61+60cst, 16 head ( 3 nozzle ), M size
NM-2577M 0.094sec, 30+30cst, 16 head ( 3 nozzle ), M size
NM-2579 0.094sec, 75+75cst, 16 head ( 3 nozzle ), LL size
MSHIII / MSH3 NM-HB00A 0.75sec, 75+75cst, 16 head ( 3 nozzle )
NM-HB10A 0.075sec, 75+75cst, 16 head( 2 nozzle).
High Speed SMD Placement /  Chip Shooter MVIIE / MV2E
MVIIF / MV2F NM-2558FA/FB 0.1sec, 75+75cst, 12 head ( 5 nozzle ), 1PC system ( option )
MVIIF / MV2F SIMM 0.16sec, ( 22500 cph ), 30+30
MVIIV / MV2V NM-HA00A/10A 0.07sec, 75+75cst, 12 head ( 5 nozzle ), 1PC system
MVllVB / MV2VB NM-HA40A/50A 0.1sec, 75+75cst, 12 head ( 5 nozzle ), PC board dimension: 50*50 to 330*250mm.
NM-HA45A/55A 0.1sec, 75+75cst, 12 head ( 5 nozzle ), PC board dimension: 50*50 to 510*460mm.
MSR NM-HD10 0.08sec, 75+75cst, 16 head ( 6 nozzle), PC board dimension: 50*50 to 330*250mm.
NM-HD15 0.08sec, 75+75cst, 16 head ( 6 nozzle), PC board dimension: 50*50 to 510*460mm.
HT122 6 nozzle, 18-head rotary system, inceased X-Y table max of 0.066 s/chip (54,500 CPH),
0603 (0201) narrow spacing, and CSP all-ball detection
HT123
Modular High Speed SMD Placement / Chip Shooter CM202
CM202-DH 0201″ chips to large (24mm X 24mm max.) parts such as BGAs, CSPs, and connectors, 0201″ chips.
CM201-DH
CM212 0.065 s/chip (55,300), x160 component feeders
CM401 30,000 pch w/ ±50 micron accuracy, MAX PCB 13″ x 10″ / multi-function head 8570 cph w/ ±35 micron accuracy
CM402 60,000 cph w/ ±50 micron accuracy, MAX PCB 18″ x 20″ / multi-function head 17,140 CPH w/ ±35 micron accuracy.
CM602 95,000 cph, 0402 (01005) chips to 90 x 100mm on up to 18″ x 20″ boards
Low Cost Modular SMD Placement Machines BM123 eight-nozzle independent vertical drive system, focused recognition scans, accuracy to 0.12 s/chip (30,000 cph),
integrated line scan sensor measures component thickness, 0603 chips to 32 x 32mm QFP and BGA chips,
small footprint 1950 x 1710mm
BM133
Low End Multi-Functional/   Flexible Mounters/IC Mounters MPA-40 NM-2528B 0.6sec/tape, 2.5sec/QFP,Chuck, 40cst, 330*250mm (M)
NM-2528T/2528 0.6sec/tape, 2.5sec/QFP,Vision, 40cst, 330*250mm
MPA-80 NM-2529B 0.68sec/tape, 2.5/QFP Chuck, 80cst, 508*381mm (LL)
NM-2529T 0.68sec/tape, 2.5/QFP Vision, 80cst, 508*381mm
MPA-G1 NM-2547A 0.48sec/chip, 2.5sec/QFP, 60cst
MPAIII / MPA3 NM-2535 0.48sec/tape, 2.0sec/QFP, 80cst, LL size
MPA-IIIF / MPA-3F NM2536F 0.48sec/chip, 2.0sec/QFP, 2.5sec/IC, XL size
Medium Range Multi-Functional/ Flexible Mounters/IC Mounters MPA-V NM2544 0.48sec/chip, 1.0sec/QFP, 80cst, BGA, M size
MPA-G2 NM2542 0.59sec/chip, 1.8sec/QFP
MPA-V2 / MPAVII NM-MA05A 0.57SEC/CHIP, 0.7SEC/qfp, 60cst, BGA, 4 nozzle
MPAV-2B / MPAVIIB NM-MA25A 0.44sec/chip, 0.53sec/qfp, VCM, 4 nozzle.
MPA-G3 NM-MB00A 0.8sec/chip, 1.0sec/QFP,BGA,3 nozzle
NM-MB10A 0.8sec/chip, 1.0sec/QFP,BGA,3 nozzle, PC board dimension: 50*50 to 330*250mm
NM-MB15A 0.8sec/chip, 1.0sec/qfp, BGA , 3 nozzle, PC board dimension: 50*50 to 510*460mm
High End Multi-Functional/ Flexible Mounters/IC Mounters MSF NM-MD15 0.094sec/chip, 96cst, 10-nozzle, 4VCM head, PC board dimension: 50*50 to 510*460mm.
NM-MD16 0.15sec/chip, 96cst, 10-nozzle, 4VCM head, PC board dimension: 50*50 to 510*460mm.
MCF NM-ME15 0.13sec/chip, PC board dimension: 50*50 to 510*460mm.
NM-ME16 0.21sec/chip, PC board dimension: 50*50 to 510*460mm.
DT-401 0402 chips, BGAs, CSPs, connectors and other large components up to 100 mm X 90 mm @ 25mm thickness,
uses the same feeder table and feeders as our CM402,
Direct pickup along with on-the-fly component replenishment and changeover allows high-speed production ,
Supports twin and single tray feeders , 8 mm double tape feeders, as well as 12/16, 24/32, 44/56 and 72 mm tape feeders ,
Interchangeable platform
Handles up to 510 mm L x 460 mm W boards
Hybrid Flexible Mounter CM101 25,000 cph, support for up to 140 components inputs with ±35 micron accuracy,
flexibility that allows for high-speed to multi-function production
General Purpose Chip/Flexible Placement BM221 12,000 cph0402 chips to 55mm QFPs, BGAs and CSPs to 150mm connectors
120 tape and reel inputs as well as 80 tray inputs.
Modular High Speed Multi-Functional Mounter BM231 14,400cph
0603 microchips to BGA’s, CSP’s and connectors, 120 8mm feeders and 80 tray feeders,
twin drive XY robot, a twin-tray integrated feeder supply
Auxillary Through-Put
Chip Mounters		 MMCG3 NM-MC00A 0.2sec/chip, 40cst, PC board dimension: 50*50 to 330*250mm
NM-MC01A 0.2sec/chip, 80cst, PC board dimension: 50*50 to 330*250mm
NM-MC06A 0.2sec/chip, 80cst, PC board dimension: 50*50 to 510*460mm
Expoxy (Glue) Dispensers HD3C NM-2626C 0.28sec, 2 head*3 nozzle, 330*250mm(m), 1608 – SOP
HD3F NM-2526F 0.25sec, 2 head*3 nozzle
HDPIIC / HDP2C NM-2660C 0.12sec, 3 nozzle
HDP-G1 NM-2663 0.12sec, 3 nozzle
HDP-G3 NM-DB00A 0.12sec, 3 nozzle, dot size recognation function.
HDP3 NM-2666
HDPV NM-DA00A 0.08sec, 2 head*3 nozzle, M size
NM-DA05A 0.08sec, 2 head*3 nozzle, M size, PC board dimension: 50*50 to 510*460mm
HDF NM-DC10 0.07sec, 3 types nozzle, screw-type head, PC board dimension: 50*50 to 330*250mm
NM-DC11 0.1sec, 3 types nozzle, air-type head, PC board dimension: 50*50 to 330*250mm
NM-DC15 0.07sec, 3 types nozzle, screw-type head, PC board dimension: 50*50 to 510*460mm
NM-DC16 0.1sec, 3 types nozzle, air-type head, PC board dimension: 50*50 to 510*460mm
Solder Paste/Screen Pinter SPP NM-2624 Vision, 20sec, 330*250mm (M), Cleaning 15sec
NM-2624B Vision, 25sec, 508*381mm (LL), Cleaning 15sec
NM-2624F
SPP-G1 NM2673 Vision
SPP-G3 NM-PB00A 13sec, PC board dimension: 50*50 to 330*250mm
SPPV NM-PA00A 11sec, PC board dimension: 50*50 to 330*250mm
NM-PA05A 16sec, PC board dimension: 50*50 to 510*460mm
SPF NM-PC10 6sec, PC board dimension: 50*50 to 330*250mm
NM-PC15 7sec, PC board dimension: 50*50 to 510*460mm
SP18
SP60
SP80
Description Machine Name Model No Features
Low Level Chip Shooter CM82C-MD/LD 0.2sec, 140cst ( 70+70 ), 16 head ( 6 nozzle )
CM82C-ME/LE 0.15sec, 140cst ( 70+70 ), 16 head ( 6 nozzle )
CM82C-MG 0.14sec, 150cst ( 75+75 ), 16 head ( 6 nozzle )
Medium Level Chip Shooter CM85C-M 0.14sec, 140cst ( 75+75 ), 16 head ( 6 nozzle ), 330*250mm
CM82C-L 0.14sec, 140cst ( 75+75 ), 16 head ( 6 nozzle ), 510*460mm
CM86C-M1 0.1 sec, 70cst ( 35+35 ), 12 head ( 6 nozzle ), 330*250mm
CM86C-M2 0.1sec, 140cst ( 35+35+35+35 ), 12 head ( 6 nozzle ). 330*250mm
High Speed Chip Shooter CM88C-M1 0.085sec/chip 0.12sec/Sop IC, 70cst, 12 head ( 5 nozzle ), 330-250mm
CM88C-M 0.85sec/chip 0.12sec/Sop IC, 70+70cst, 12 head ( 5 nozzle ), 330*50mm
CM88C-D 0.85sec/chip 0.12sec/Sop IC, 70+70cst, 12 head ( 5 nozzle ), 460*60mm
Low Level Flexible/Multi-Function Mounter CM92P-MT 0.48sec/chip, 1.0sec/stick, 2.5sec/QFP
CM92P-MX 0.48sec/chip, 1.0sec/stick, 2.5sec/QFP, 4.0/BGA, 1 head, CSP
CM92R-M 0.3sec/stick, 1.25sec/QFP, 330*250mm
Medium Level Flexible/Multi-Function Mounter CM95R-M 0.3sec/stick, 1.25sec/QFP, BGA, 2head, 330*250mm
CM95R-L 0.6sec/chip, 2.5sec/QFP ,BGA, 510*460mm
CM20F-M 0.58sec/chip, 1.1sec/QFP,330*250mm, 3 head, BGA,CSP
High Level Flexible/Multi-Functional Mounters CM100-M 1.0sec/QFP,BGA,CSP
CM120-MU 0.6sec/chip, 0.9sec/QFP, 330*250mm, 3 head, BGA, CSP
Epoxy (Glue) Dispensers BD12S-M 0.08sec, 3 nozzle, 330*250mm
BD12S-MR 0.12sec, 4 nozzle, 330*250mm
BD12S-LR 0.12sec, 4 nozzle, 510*460mm
BD20S-M 0.08sec, 3 nozzle, 330*250mm
BD30S-M 0.08sec, 3 nozzle, 330*250mm
Solder Paste/Screen Printer SP10P-MA 17sec, Vision, 330*250mm
SP10P-LA 27sec, Vision, 510*460mm
SP11P-MA 17sec, Vision, 330*250mm
SP20P-MA 9+, Vision, 330*250mm
SP22P-M 9+, Vision, 330*250mm
Description Machine Name Model No Features
Low End SMD Placement/ Chip Shooter CPIII-4000 0.25sec, 140cst ( 70+70 ), 12 head*2 nozzle
CPIV / CP4 0.18sec, 140cst ( 70+70 ), 12 head*3 nozzle, 1005 – 20mm QFP/PLCC
CPIV-2 / CP4-2 0.18sec, 140cst ( 70+70 ), 12 head*3 nozzle,( 3 type ), 457*356mm
CPIV-3 / CP4-3 0.15sec, 160cst ( 80+80 ), 12 head*3 nozzle. 1005 – 20mm SQFP/PLCC
Medium SMD Placement/ High Speed Chip Shooters CP6-5E 0.12sec, 140cst ( 70+70 ), 508*485mm, 6 nozzle
CP6-5000 0.12sec, 140cst ( 70+70 ), 508*485mm, 6 nozzle, 508*458mm (MAX )
CP-6(4000) 0.09sec, 140cst ( 70+70 ), 6 nozzle, 457*356mm (MAX), Twin D-Axis Motor
CP-6M(4000) 0.09sec, 100cst ( 50+50 ), 6 nozzle, 457* 356mm (M)
CP-642 0.09sec, 140cst ( 70+70 ), 6 nozzle
CP-643E 0.09sec, 140cst, PCB Loading 0.7sec, 6 nozzle, 356*457mm
CP-643M 0.09sec, 100cst, PCB Loading 0.7sec, 6 nozzle, 356*457mm
CP6-43ME
High End SMD Placement/ High Speed Chip Shooters CP7-32E
CP7-42E
CP7-43E
CP8-42E
CP8-43E
Large Board SMD Placement NP-153E
High End Modular SMD Placement/ High Speed Chip Shooters XP-142E
XP-143E 0402(mm)parts support is standard
Optional side-lighting on side 2 for BGA/CSP
Buffer on out-conveyor
Optional nozzle auto changer [for faster changeovers, nozzle change during auto production will be also supported.] Optional single tray [Max 2 x JEDEC trays, Max PCB width is limited to 200mm] 0402 to 20 x 20 mm
0.165 seconds/shot at an accuracy of ±0.06 mm
NXT interchangeable placement heads allow each machine module to function
as either a high speed chip mounter or a multi-function placement machine
M3 (320 mm wide) and M6 (645 mm wide) modules
The NXT can accommodate PCB sizes up to 20″ X 21″ and is equipped with automatic rail width adjustment and an optional automatic tooling pin support system.
Intelligent feeders
Low – Medium Flexible/Multi-Functional Mounters IP-I-4000 1.5sec/chip, 2.8sec/IC, 1 head, MFU, 457*356mm
IP-II-4000 0.7/chip, 4.0/tray, 74cst, 2 head*1 nozzle, MFU(2), MTU(10), 457*356mm
IP-III(5000) 0.55sec/chip, 1.25sec/IC, 25sec/tray, 74cst, 2 head*1 nozzle
QP242 1.2 – 2.5sec/shot, 6 module, 21 cst, tray 100step,457*356mm
QP242E multiple MTU’s, MFU’s, feeder trolleys, head config
QP341E multiple MTU’s, MFU’s, feeder trolleys, head config
QP351E multiple MTU’s, MFU’s, feeder trolleys, head config, large PCB
Large Board Flexible/Multi-Functional Mounter NP-251E
High End Flexible/Multi-Functional Mounters XP-242E
XP-243E On-the-fly vision inspection and optical correction ensure the most accurate placements.
Fuji’s new dual vacuum (V2) nozzle holder performs exceptionally high-speed nozzle
changes of 0.6 seconds
0603 standard
Newest High Mix/Low Volume Placement Machine AIM 180 feeder inputs, a placement range from 0201 components thru 74mm square and a rated speed of 20,300 cph.
The AIM will accommodate components supplied on Tape & Reel, Strip Tape, Stick, and Matrix Trays.
The platform features (4) interchangeable placement heads mounted on two gantries that allow the user to
reconfigure the machine from a chip shooter, to flexible placer, or a combination of both in just minutes
Epoxy (Glue) Dispenser GLII-4000 / GL2 0.2sec, 2 nozzle, Vision
GLV-5000 / GL5-E 0.13sec, 3 nozzle, Vision
GL-541E 0.09sec, 3 nozzle
Solder Paste/Screen Printer GSP-2-4000 VISION, 457*356mm. 8 sec
GSP-3-4000 VISION, 457*356mm
GSP-5-4000 VISION, 457*356mm
GP341 VISION, 457*356mm
GP641E VISION, 457*356mm
Description Machine Name Model No Features
Low End SMD Placement/ Chip Shooter TCM-1050 0.14sec, 160cst ( 40+40+40+40 ), 24 head*6 nozzle
TCM-110/1100E=UIC4791 0.12sec, 160cst ( 40+40+40+40 ), 24 head*6 nozzle, M size
TCM-1500 0.14sec, 160cst ( 40+40+40+40 ), LL size, 16 head
TCM-1600/1600E-UIC4792 0.12sec, 160cst ( 40+40+40+40 ), LL size
Short Carriage Chip Shooter TCM-3100S/3000S 0.1sec, 40+40cst
Medium SMD Placement/ Chip Shooter TCM-3500E/3000E 0.1sec, 80+80cst
Short Carriage Chip Shooter TCM-3600J/3100J 0.1sec, 40+40cst
High Speed SMD Placement/ Chip Shooter TCM-3500Z/3000Z 0.1sec, 80+80cst
TCM-3700 16 pick and place heads,
capable of mounting 0201 components, placement speed of 0.1 sec
High Speed Direct Drive SMD Placement/ Chip Shooter TCM-X110/X210/X300
TCM-X110J/X110M/X300S
High Speed Modular SMD Placement Machine/Chip Shooter GXH-1
GXH-1J
GXH-1S
GXH-1JS
Low End Flexible/Multi-Functional Mounter TIM-1000 0.55sec/chip, 1.6sec/tray,BGA ( toption )
TIM-1100/1000E 0.6sec/chip, 1.6sec/tray,BGA ( option )
Medium Flexible/Multi-Functional Mounter TIM-5000F/5000R 0.45sec/chip, QFP/BGA (option )
High End Flexible/Multi-Functional Mounter TIM-X100
Glue (Epoxy) Dispenser TDM-1000 0.12sec, 4 nozzle
TDM-3500E/3000E 0.08sec, 3 nozzle ( option 4 nozzle )
Solder Paste/Screen Printer TPM1000 VISION
TPM1100 VISION
TPM-110 Printer
Description Machine Name Model No Features
Low-Med-High Speed SMD Placement Machines/Chip Shooters 4785 0.25sec, 24 head*4 nozzle
4790 0.14sec, 24 head *6 nozzle
4791 (=TCM1100) 0.12sec, 160cst ( 40+40+40+40 ), 24 head*6 nozzle, M size
4792 (=TCM1600) 0.12sec, 160cst ( 40+40+40+40 ), 24 head*6 nozzle, LL size
4795A 0.1sec, 160cst ( 80+80 ), 250*330mm, 16 head*5 nozzle
4795S 0.1sec, 80cst ( 40+40 ), 250*330mm, 16 head*5 nozzle
4796A 0.1sec, 160cst ( 80+80 ), 360*460mm, 16 head*5 nozzle
4796R HSP 0.1sec, 40+40 cst
NEW High Speed Turret Style SMD Chip Shooter 4797A/S 0.08sec, Feeder Capacity:160 or 60, Component Range: 0201–26sqmmCSP/BGA.
NEW Modular High Speed/Flexible SMD Placement Machine/Chip Shooter Quadris-S four-gantry placement, offering the latest advantages of both turret-style and overhead gantry technologies to deliver concentrated throughput in a small footprin
Flexible/Multi-Functional Mounters GSM1 (4681A) 2 head single beam, 18″ X 20″ PCB, 4700 cph, G BLOCK
GSM1 (4685A) L BLOCK
GSM2 (4688A)
NEW Modular High Speed/Flexible SMD Placement Machine Genesis modular performance, delivering the speed and flexibility to high-speed and flexible fine pitch placement
NEW Mid-Range Flexible SMD Placement Machine AdVANTIS next-generation midrange platform, offering unbeatable flexibility, lighting head
Epoxy (Glue) Dispenser GDM4716 42000 dot/hr
Description Machine Name Model Name/No Features
Low-Med-High End SMD Placement Machines/               Chip Shooters/ Flexible/Multi-Functional Mounters SP-120 7.200 cph
HS-180 4.000 cph
80 S-15 Siplace Two Revoler
80 F4 Siplace 7200 cph, One rev + one IC, vision
80 F5 Siplace 8,000 cph, 0.4sec/QFP,BGA, 6 nozzle head
80 F5HM Siplace 12.000 cph, BGA, 12 nozzle head
80 S20 Siplace 24.000 cph, 24 nozzle head
SIPLACE S-23 HM
SIPLACE HS-50 50.000 cph, 4 Revolver Head*12 nozzle, 96cst
SIPLACE S-25 HM
SIPLACE HF
SIPLACE HS-60
SIPLACE HF/3
Description Machine Name Model No Features
SMD PLACEMENT MACHINES / CHIP SHOOTERS YV100 0.25sec/chip, 8 head, Laser/vision, 100cst
YV112 0.25sec/chip, 112cst, vision, 16 head*2
YV120 0.33sec/chip, 1.5sec/QFP, 120cst, 8 head, Laser/vision
YV100II 0.25sec/chip, 1.7sec/QFP, 100cst, 8 head, Laser/vision
YV112II 0.2sec/chip, 112cst, 16 head*2,Vision
YV112III 0.10sec/chip, 112cst, 12 head*2,Laser/vision, 1005 – 21mm QFP
Flexible.multifunctional Mounters YV100X 0.2sec/chip
YV100Xg 0.18sec/chip, 100cst, PCB Size: L460*W382
YV100XT 0.15sec/chip, 100cst, 2 heads (8 nozzle), PCB Size: L330*W250
YM84VII 0.45sec/chip, 2.7sec/QFP, 3 head ( 2:Chuck,1:Vision ), 84cst
YM84VIII 0.42sec/chip, 2.1sec/QFP, 84cst
YVL80 0.62sec/chip, 1.7sec/QFP
YVL88 0.49sec/chip, 1.5sec/QFP, 2 head, 94cst,Laser/Vision
YVL88ii 0.45sec/chip, 1.5sec/QFP, 2 head, 94cst
YVL88F
YV88X 0.9sec/QFP, 457*407mm
YV88Xg 0.55sec/chip, 94cst, PCB Size: L460*W382
YV180X 0.11sec/chip, 80cst, PCB Size: L380*W330
Epxoy (Glue) Dispensers YM12D 0.3sec, 2 nozzle
YM84D 0.18sec, 3 nozzle
YM84DIII 3 nozzle
YV64D 0.13sec, 2 head
YV86D 0.13sec, 3 nozzle
HSD 0.08sec, Pluger 2 nozzle, 407*457mm
YV100D 0.13sec, 3 nozzle Vision
Description Machine Name Model No Features
High Speed SMD Placement/ Chip Shooters KE-730 0.28sec/chip, 80cst, Laser, 3 head
KE-750 0.25sec/chip, 80cst, Laser, 3 head
KE-2050R
KE-2070R
FX-1R
Flexible/Multi-Functional Mounters KE-720 0.75sec/chip, 1.8sec/vision, 2 head
KE-740 (Zevatech 740) 0.34sec/chip, 80cst,Laser 2 head
KE-760 0.32sec/chip, 1.8sec/QFP, 80cst+20tray,Laser 2 head,BGA
KE-2010 0.33sec/chip,1multi nozzle laser head(4 nozzles),
From 0603(0201) chip to 26.5–11mm chip or 20mm spuare chip
KE-2020 0.33sec/chip, 2sec/IC,1multi nozzle laser head(4 nozzles)
and 1 high-resolution head(1-nozzles), From 0603(0201) chip to 50mm spuare chip.
KE-2030 0.18sec/chip, Multi-laser head*2 (8 nozzles),
From 0603(0201)chip to 26.5–11mm chip or 20mm spuare chip
KE-2060R
KE-2080R
Description Machine Name Model No Features
SMD Placement Machines CP11 0.46sec/chip, 56cst, 2 head Chuck
CP30 0.25sec, 450*400mm, 2 head Chuck, 104cst
CP30L 0.27sec/chip, 0.85sec/IC, Line CCO, 450*400mm, 104cst, 3 head
CP40L 0.24sec/chip, 0.85sec/IC, Line CCD, 460*400mm, 104cst, 3 head
CP60V 0.15sec/chip, 1.15sec/QFP, 9 head, 10cst
VP60L 0.15sec, Line CCD, 508*400mm, 116cst, 6 headt
VP60LM 0.1sec, 6 heads( 12 nozzles).
Flexible/Multi-Functional Mounters CP15VL 0.97sec/chip, 1.7sec/QFP, 68cst, 607*457mm
CP30V 0.25sec/chip, 1.7sec/QFP, 104cst, 3 head
CP33LV 0.27sec/chip, 1.3sec/IC, Line CCO & Vision, 104cst, 3 head
CP40LV 0.24sec/chip, 1.3sec/IC, Line CCD & Vision, 3 head
CP45FV 0.188sec/chip, 0.5sec/IC, 6 head/12 nozzle, Full vision
CP50M 0.34sec/chip, 1.3sec/IC, Line CCD & Vision, 3 head
Description Machine Name Model No Features
SMD COMPONENT PLACEMENT MACHINES MT-5600SQ 4 head/ATC
MT-5630ZQ 0.26sec/chip, 2.2sec/QFP, 4 head chuck ( option?1 head vision ), 134cst
MT-5530E 0.36sec/3 head, 0.45sec/ 2 head, 118cst,standard 2 head chuck ( 1 head option )
MT-5720ZV 0.36sec/chip, 1.7sec/QFP, 134cst, 4 head ( 3 head chuck,1 head vision )
MT-5720VM 0.82sec/chip ( 1 head ), 1.7sec/QFP(vision), 134cst, 3 head ( 1 head bond )
MT-5720DP 0.47sec/chip, 122cst, 3 head ( 2 head chuck, 1 head bond )
MT-5530LQ 0.26sec/chip, 1.2sec/QFP, 4 head Laser-vision
MT-5530LV 0.33sec/chip, 1.5sec/QFP, 61cst, 3 head Laser-vision
MT-5800V 0.48sec/chip, 1.7sec/QFP, 4 head vision, 134cst
MT-5720ZL 0.36sec/chip, 1.7sec/QFP, 134cst, 4 head vision
FV-7100 0.195sec/chip, 0.7sec/QFP,bga, 6 head, 120cst
Description Machine Name Model No Features
Semi-Automatic / Automatic w/Vision & High End Solder Paste/Screen Printers DEK 247 Semi Auto, 12″ X 12″ Print area
DEK 248 Semi Auto, 20″ X 20″ stencil
DEK 249MKII Visio semi Auto, 432 X 411,, Print area
DEK 260 Semi Auto, 20″ X 20″ stencil
DEK 265MK1 In-line Vision PCB 508*508mm, 10 – 150mm/sec, XY single camera
DEK 265GS 16sec, In-line Vision, 2D stencil & Board, PCB 508*508mm
DEK 265GSX 10sec, 2D stencil & Board inspection
DEK 265LT 12.5sec, 2D stencil & Board inpection, 20″ * 19.25″ PCB
DEK 288 5sec, 0.90 adi, 2D stencil & board inpection
DEK Infinity Print speed 2–150mm/sec, 2D inspection.Cycle time: 8sec
DEK ELA Print speed 2–150mm/sec, Cycle time: 14.5sec
DEK Horizon
Galaxy
Europa
i-Automatic / Automatic w/Vision & High End Solder Paste/Screen Printers Machine Name Model No Features
SP2400 Semi Auto
AP24X Vision, In-line, 24 X 24″
AP25
AP27 Vision, In-line
Ultraprint 200 Vision, semi Auto, 22″ X 22″
Ultraprint 2000 Vision, In-line
Ultraprint 2020 Vision, In-line
Ultraprint 2030 Vision, In-line
Ultraprint 3000 2D/3D, Vision In-line, Auto stencil Clean, Vision S/P 0 – 90
Ultraprint 3030 2D/3D, Vision In-line, Auto stencil Clean
Ultraprint 3050 2D/3D, Vision In-line, Auto stencil Clean
UP 2000 HiE
UP 3000 HiE
Accela
AccuFlex
APExcel
UP 2000 Elite
Automatic / Automatic w/Vision & High End Solder Paste/Screen Printers Machine Name Model No Features
MK280SA Semi Auto, 170 * 120mm
MK510FA In-line Auto, 330*250mm (M)/450*350mm (L), 25sec, 0.5 – 2.0 mmt (PCB)
MK610FA In-line Auto, 330*250mm (PCB), 18sec, 0.5 – 2.0 mmt (PCB)
MK810SV Vision, 330*250mm (M)/407*450mm (L), 30sec, 0.5 – 2.0 mmt (PCB)
MK850SV Vision, 330*250mm (PCB), 16sec
MK880SV Vision, 330*250mm (M)/450*410mm (L), 10sec, 0.4 – 2.5 mmt (PCB)
MK868SV Vision, 330*250mm (PCB), 8sec, 0.4 – 2.5 mmt (PCB)
Semi-Automatic / Automatic w/Vision & High End Solder Paste/Screen Printers Machine Name Model No Features
E1 Semi-auto, 10–110mm/sec, Print area: 430*570mm
E4 550*560mm, Solder paste, Cleaning
E5 Vision in line, 550*560mm, Solder paste Cleaning
M2 Cycle time 3 secs plus printing time, Max. print area: 180*120mm
M3 Cycle time 3 secs plus printing time, Max. print area: 127*152mm
M8 Cycle time 3 secs including printing time, Max. print area: 200*300mm
X5 Fully auto/vision, 5-199mm/sec, Print area: 460*460mm
E5HYB 2 independent print heads, Max. print area: 330*250mm
E5LCD 2 independent print heads, Max. print area: 550*550mm